2-inch Free-standing U-GaN Substrates
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Excellent level (S)
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Production level (A)
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Research level (B)
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Dummy level (C)
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Note:
(1) Useable area: edge and macro defects exclusion
(2) 3 points: the miscut angles of positions (2, 4, 5) are 0.35 ¡À 0.15¡ã
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S-1
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S-2
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A-1
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A-2
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Dimension
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50.8 ¡À 1 mm
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Thickness
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350 ¡À 25 ¦Ìm
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Orientation flat
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(1-100) ¡À 0.5¡ã, 16 ¡À 1 mm
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Secondary orientation flat
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(11-20) ¡À 3¡ã, 8 ¡À 1 mm
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Resistivity (300K)
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< 0.05 ¦¸¡¤cm for N-type (Si-doped; GaN-FS-C-N-C50)
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TTV
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¡Ü 15 ¦Ìm
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BOW
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¡Ü 20 ¦Ìm
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¡Ü 40 ¦Ìm
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Ga face surface roughness
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< 0.2 nm (polished)
or < 0.3 nm (polished and surface treatment for epitaxy)
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N face surface roughness
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0.5 ~1.5 ¦Ìm
option: 1~3 nm (fine ground); < 0.2 nm (polished)
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Package
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Packaged in a cleanroom in single wafer container
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Useable area
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> 90%
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>80%
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>70%
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Dislocation density
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<9.9x105 cm-2
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<3x106 cm-2
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<9.9x105 cm-2
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<3x106 cm-2
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<3x106cm-2
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Orientation£ºC plane (0001) off angle toward M-axis
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0.35 ¡À 0.15¡ã(5 points)
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0.35 ¡À 0.15¡ã(5 points)
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0.35 ¡À 0.15¡ã(3 points)
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Macro defect density (hole)
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0 cm2
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< 0.3 cm -2
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< 1 cm -2
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Max size of macro defects
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< 700 ¦Ìm
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< 2000 ¦Ìm
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< 4000 ¦Ìm
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